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| Customization: | Available | 
|---|---|
| Type: | Rigid Circuit Board | 
| Dielectric: | FR-4 | 
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Material  | FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, PI Material, BT Material, PPO, PPE etc.  | 
Board Thickness  | Mass production: 394mil(10mm) Samples: 17.5mm  | 
Surface finish  | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger  | 
PCB Max panel size  | 1150mm × 560mm  | 
Layer  | Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers  | 
Min. Hole Size  | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)  | 
PCBA QC  | X-Ray, AOI Test, Functional Test  | 
Special Process  | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.  | 
Our service  | PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers  | 
Sanforized  | Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control.  | 
SMT Capacity  | 7 Million Points/Day  | 
DIP Capacity  | 5 Million Points/Day  | 
Certificate  | CE/RoHS/ISO9001/ISO14001/ISO13485/TS16949  | 





